ACT Logo
|ADVANCED COOLING TECHNOLOGIES
0
Cart Icon
Contact Us
  • Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Active Thermal Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek® ECU
      • Tekgard® Chillers
    • Data Center Solutions
      • Coolant Distribution Units (CDU)
      • Single- and Two-Phase Liquid Cold Plates
      • Manifolds
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • HVAC Energy Recovery
      • AAHX
      • WAHX
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Space Thermal & Structural Design & Analysis
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
  • Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Design & Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
      • Ground Defense
    • Medical
    • Data Centers
    • Other
  • Composites
    • Composite Structures & Assemblies
    • Honeycomb Radiator Panels
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Shop
  • Contact
  • Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Active Thermal Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek® ECU
      • Tekgard® Chillers
    • Data Center Solutions
      • Coolant Distribution Units (CDU)
      • Single- and Two-Phase Liquid Cold Plates
      • Manifolds
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • HVAC Energy Recovery
      • AAHX
      • WAHX
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Space Thermal & Structural Design & Analysis
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
  • Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Design & Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
      • Ground Defense
    • Medical
    • Data Centers
    • Other
  • Composites
    • Composite Structures & Assemblies
    • Honeycomb Radiator Panels
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Shop
  • Contact
0
Cart Icon View Cart

NASA Selects Advanced Cooling Technologies as ACO Partner for Innovative Space Thermal Management Flight Demonstration

Lancaster, PA, July 27th, 2026— Advanced Cooling Technologies, Inc. (ACT), a leader in advanced thermal management solutions, is proud to announce that NASA has selected the company as an Announcement of Collaboration Opportunity (ACO) partner for the 3D-Printed Loop Heat Pipe with Deployable Radiator Panel and Thermal Control Valve Flight Test.

The collaboration recognizes ACT’s leadership in developing next-generation spacecraft thermal management technologies that leverage additive manufacturing to improve performance, reduce mass, and lower production costs for future space missions.

The flight demonstration will evaluate a highly integrated thermal control system featuring a 3D-printed Loop Heat Pipe (LHP), a Deployable Radiator Panel (DRP), and a Thermal Control Valve (TCV). Together, these technologies are designed to efficiently transport and reject heat from spacecraft electronics while enabling higher-power payloads within the size and weight constraints of modern small satellites.

NASA’s Announcement of Collaboration Opportunity program brings together government, industry, and academic partners to mature promising technologies that support future exploration and commercial space missions. ACT’s participation in this flight demonstration represents another milestone in the company’s long history of developing innovative thermal management solutions for aerospace and defense applications.

“Being selected as an ACO partner by NASA is an exciting opportunity to demonstrate technologies that have the potential to significantly improve spacecraft thermal management,” said Bryan Muzyka, Senior VP of Sales and Marketing at ACT. “This collaboration highlights our commitment to advancing additive manufacturing and passive thermal control technologies that enable more capable and cost-effective space systems.”

ACT has pioneered the development of additively manufactured Loop Heat Pipes, integrating complex wick structures and evaporator components into single 3D-printed assemblies. These innovations simplify manufacturing while maintaining the high reliability and performance required for spaceflight. Coupled with deployable radiator technology and advanced thermal control, the system is intended to provide efficient heat rejection for next-generation spacecraft operating in increasingly demanding environments.

The collaboration builds upon years of ACT research and development in advanced thermal technologies and reinforces the company’s role as a trusted partner supporting NASA’s mission to advance space exploration through innovation.

More information about NASA’s Space Technology Industry Partnerships and the Announcement of Collaboration Opportunity program is available on NASA’s Space Technology website.

Special acknowledgements to Philip Graybill and Larry Bradley.

About Advanced Cooling Technologies, Inc.

Advanced Cooling Technologies, Inc. (ACT) is a premier thermal management solutions company, providing design and manufacturing services to meet our customers’ needs across all points of the product lifecycle. We serve our global customers’ thermal management and energy recovery needs in diverse Markets including Defense, Aerospace, Electronics, HVAC, Data Centers and Energy. We specialize in providing innovative and performance-optimized thermal management technologies and solutions that meet the unique needs of each customer.

ACT Logo
Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601, USA
(717) 295-6061 Contact Our Experts
linkedin youtube twitter facebook
  • shop products online
  • sitemap
  • privacy policy
  • do not sell
  • California privacy policy
  • terms & conditions
  • ISO9001 & AS9100 CERTIFIED, ITAR REGISTERED

Copyright 2026. All rights reserved.