ACT’s Advancements in Vapor Chamber Technology
Advanced Cooling Technologies, Inc. (ACT) recently developed a 3mm thick vapor chamber made of a copper plated ceramic casing that has a coefficient of thermal expansion (CTE) close to silicon. This allows direct bonding of semiconductor chips to the vapor chamber. Direct soldering of the chips to the vapor chamber reduces the thermal interface resistance and eliminates the need for mechanical clamping. The chips can be placed anywhere on the vapor chamber surface. The heat sink locations can also be flexible. For example, the condenser can be at the sides as is typical for liquid cooling or over the entire vapor chamber surface opposite the chip locations as is typical for air cooling.
Low Thermal Resistance Achieved Independent of Vapor Chamber Heatsink Location
Another focus of ACT’s advanced vapor chamber development effort is in the wick design to achieve very high heat flux capability and low thermal resistance. The advanced wick designs enable effective separation of liquid and vapor phases, resulting in vapor chamber performances exceeding 500W/cm2 in heat flux, lower than 0.05°C-cm2/W in evaporator thermal resistance, and lower than 0.12°C-cm2/W in overall vapor chamber thermal resistance. The evaporator thermal resistance has been shown to be independent of the vapor chamber heat sink location and geometry.
Vapor Chambers Featuring Scalable Wick Designs
Additionally, ACT’s advanced wick designs are scalable to accommodate varying heat source sizes, from less than 0.6cm2 to greater than 10cm2, without any adverse effects on the evaporator resistance. ACT’s vapor chambers are recommended as heat spreaders for high heat flux chips (IGBTs, MOSFETs), high power Laser Diode Array’s, Phased Array Radars or similar applications.
Contact Us to Learn More About Our Vapor Chamber Technology
Contact Advanced Cooling Technologies, Inc. today for more information about our vapor chamber heat spreaders and all of our thermal management solutions.