ACT Expands Product Line to Include Enhanced Heat Sinks for Power Electronics Cooling

Lancaster, Pennsylvania – November 29, 2010. Advanced Cooling Technologies, Inc. (ACT) announces that it has created a new product line for power electronics cooling. Over the past year ACT has worked with several tier 1 military suppliers to develop heat pipe assisted heat sinks for power electronics cooling applications.   This work has led to ACT integrating its HiK Plate products to enhance the thermal performance of forced and natural convection heat sinks for the power electronics market.  “This is a natural extension of our HiK plate product line which was originally developed for military electronics cooling, particularly heat spreading in standard ruggedized packaging,” said Scott Garner, Vice President of ACT’s Electronics Products Group.
Power electronic devices dissipate large amounts of heat relative to their package footprint, which requires a heat sink significantly larger than the device. This results in large conduction-induced temperature gradients within the heat sink, which greatly decreases the overall heat sink efficiency. ACT’s HiK plates isothermalize the heat sink base and therefore minimize the conduction gradients. The embedded heat pipes are typically integrated directly into the heat sink base plate, significantly improving the heat sink’s thermal performance without impacting its weight or volume. Additional details and product information can be found at: Typical applications for these types of heat sinks include:

  • Insulated Gate Bipolar Transistors (IGBTs)
  • Thyristers – Intelligent Power Modules (IPMs)
  • Symmetric Gate Commutated Turn-Off Thyristor (SGCT)
  • Silicon Controlled Rectifiers (SCRs)


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