Aluminum Silicon Carbide (AlSiC) is a metal matrix composite that is designed to have a low coefficient of thermal expansion (CTE).
This is made possible by adjusting the composition of Al and SiC to create a surface that has a low enough CTE for direct attachment of electronic components. By embedding heat pipes into these plates, ACT demonstrates thermal advantages similar to traditional aluminum HiK™ plates, with the added benefit of having a low CTE mounting surface.
HiK™ AlSiC Plates for Electronics Cooling
Semiconductor devices tend to have low CTE, when mounted to traditional metal heat spreaders there is a significant CTE mismatch which causes the need for a stress reduction material such as a gap pad. These necessary components have poor thermal properties and often lead to lower performance from the heat spreader and overall cooling solution. With an AlSiC HiK™ plate solution, you can create higher system performance by eliminating the need for a gap pad AND increasing your thermal capability due to the embedded heat pipes.
Compared to other low CTE high conductivity heat spreaders, ACT’s AlSiC HiK™ plate is a cost effective solution that can provide the necessary thermal capability to meet your system requirements.
Thermal Conductivity vs. CTE of various materials (click for larger version)
Cost vs. Thermal Conductivity for Various Heat Spreaders (click for larger version)
For further information please call an ACT engineer or email us your question: Contact ACT