Aluminum Silicon Carbide (AlSiC) is a metal matrix composite that is designed to have a low coefficient of thermal expansion (CTE).
This is made possible by adjusting the composition of Al and SiC to create a surface that has a low enough CTE for direct attachment of electronic components. By embedding heat pipes into these plates, ACT demonstrates thermal advantages similar to traditional aluminum HiK™ plates, with the added benefit of having a low CTE mounting surface.
Semiconductor devices tend to have low CTE, when mounted to traditional metal heat spreaders there is a significant CTE mismatch which causes the need for a stress reduction material such as a gap pad. These necessary components have poor thermal properties and often lead to lower performance from the heat spreader and overall cooling solution. With an AlSiC HiK™ plate solution, you can create higher system performance by eliminating the need for a gap pad AND increasing your thermal capability due to the embedded heat pipes.
Compared to other low CTE high conductivity heat spreaders, ACT’s AlSiC HiK™ plate is a cost effective solution that can provide the necessary thermal capability to meet your system requirements.
For further information please call an ACT engineer or email us your question: Contact ACT