Innovative Solutions to Meet Thermal Performance of High-Powered Laser Systems

Innovative Solutions to Meet Thermal Performance of High-Power Laser Systems

 Bryan Muzyka, Advanced Cooling Technologies, Inc.

 Introduction

Although there have been significant strides made in the last few years to increase the efficiency of laser systems, thermal management remains a critical design area. There is more demand than ever on designers to provide more capable systems, which, despite improved efficiency, leads to higher power densities and increases the overall waste heat of these systems. Across various industries that rely on laser technology, such as medical, defense and industrial manufacturing, there is a shared need for compact thermal management systems. This combination of high power and compact packaging creates the need for highly efficient heat transport and dissipation techniques. Two-Phase (liquid to vapor) technology enables many designers to achieve higher heat flux, higher total power and volume & weight efficient designs. The two primary liquid to vapor two-phase technologies being applied to the Photonics industry are passive heat pipe technology and active pumped two-phase (P2P) technology.

Heat Pipes

Heat pipe technology is a closed loop system that takes advantage of the latent heat of vaporization of the fluid to provide extremely high heat transfer coefficients and extremely low thermal resistance across the length of the pipe. It’s beneficial in many designs because of its high reliability and passive operation. In high heat flux systems, such as laser diodes, heat pipes are used to accomplish one of two purposes: (1) point to point heat transfer; moving heat from the source to a remote heat sink or (2) spreading heat along a surface to reduce conduction gradients. The operation is such that the fluid boils at the heat source, moves via an internal pressure gradient to colder areas along the length and gives up its latent heat to condense back to liquid. The liquid is then transported back to the heat source via an internal wick structure that is integrated along the ID (inner diameter) of the pipe. A side and axial cross section of a heat pipe is shown in Figure 1.

To accomplish the boiling and condensing phenomenon, while maintaining a low thermal resistance, the fluid must be processed under a vacuum. This allows the fluid to be two-phase across a wide temperature range. In a well evacuated and sealed heat pipe, the operating pressure will follow the saturation curve of the fluid. The envelope and wick material are determined by fluid compatibility and pressure containment requirements. The saturation curve for water is shown in Figure 2. Using a copper envelope, which is fully compatible with water, operation can exceed 180 C, well above the failure point of most diodes and electronics.

Overall, a well manufactured copper-water heat pipe operating within its limitations will have a temperature gradient of less than 5 C across its length. This temperature gradient is caused by thermal resistance stack up within the heat pipe, the largest delta T is caused by the heat entering and exiting the envelope (conduction through the wall and wick). The evaporation, condensation and vapor space temperature drops are all relatively low meaning that the length of the heat pipe does not affect the temperature gradient to a large degree.  Therefore, the aforementioned < 5 C delta T is valid for water heat pipes of various lengths, assuming no heat pipe limit has been exceeded. The major limits for consideration in most copper-water heat pipes for laser diode cooling are: (1) capillary limit, (2) entrainment limit, (3) boiling limit, as described below:

Capillary Limit: In systems operating in adverse orientation (condenser below the evaporator, see Figure 1.), the capillary limit is the most common limiting factor. It determines the amount of power a heat pipe can transport, which is limited by the amount of liquid that can be returned to the evaporator. The wick structure, through its porosity and permeability, creates a capillary pressure drop that must overcome or balance the other pressure drops in the system (liquid (l), vapor (v) and gravitational (g)). Equation 1 shows the capillary limit equation, where r1 and r2 are the radius of curvature depending on the pore size of the wick structure.

Entrainment Limit: occurs when the vapor velocity in the heat pipe is high enough to shear liquid from the wick. Essentially, this limit reduces the liquid flow returning to the evaporator. It is most common at low temperatures (when fluid density and vapor velocities are high).

Boiling Limit: In normal operation, the wick remains saturated with liquid; heat is conducted through the wick and vaporizes at the wick ID. At high heat flux, temperature drop across the wick increases to the point that vapor bubble nucleate occurs, disrupting liquid flow. As a general guideline, in order to avoid the boiling limit for copper-water pipes using screen or sintered powder, operate with heat flux < 75 W/cm².

Each of the above limits is dynamic with the operating temperature of the heat pipe. The Figure below shows the performance of a screen wicked heat pipe. The left Figure shows each limitation in a different color and the right Figure shows the heat pipe performance by selecting the lowest operational point at a given temperature. Note: Sonic limit occurs when the exit velocity of the vapor is too high. This is only a concern at very low temperatures.

Determining the power capacity of a heat pipe is one major hurdle in heat pipe design. The next area to understand is the practical integration of heat pipes within your system. The design flexibility of copper-water heat pipes is a major benefit to the engineer; the thin-walled design allows heat pipes to be bent and flattened into countless configurations. Practical considerations include maintaining a centerline bend radius greater than 3xOD (outer diameter) for each bend, and flattening no more than 2/3 the OD of the pipe. [Note: Flattening of a heat pipe will affect the vapor space geometry and transport power calculations.]

The final practical consideration for heat pipe integration is the attachment method. Using a copper-water design allows for several options, most common are epoxy or solder. Epoxy has a lower thermal conductivity and is a weaker bond, however it can be applied to most materials. While solder has thermal and mechanical advantages, it does require a plating operation when attaching to non-wetting materials such as aluminum. In most ruggedized or harsh environment applications, customers prefer fully embedded heat pipes, as shown in the right image of Figure 4. These high thermal conductivity plates or HiK™ plates, provide the same structural integrity and weight as an aluminum heat sink, with the effective thermal conductivities ranging from 500 to 1,200 W/m-K depending on geometry (reference: Al6061: k~167W/m-K)

The final component to understand is how to model the system level thermal performance when integrating heat pipes into your design. In most photonics applications, the system complexities demand computational software to achieve an accurate model. Finite Element Analysis (FEA) and Computational Fluid Dynamics (CFD) are often leveraged to predict system level thermal performance, and to verify safe operating temperatures can be maintained at the diodes. When analyzing a heat pipe using computational software, it’s imperative to simplify the physics; running models with two-phase flow or internal film coefficients is often too time consuming. One way to accomplish this is to model the heat pipe as a solid conduction element with an effective conductivity that simulates the overall temperature gradient of 3-5 C. For a six (6) inch heat pipe, that k value is approximately 10,000 W/m-K. Longer heat pipes will have a higher k value. This estimation can save significant computational time and still provide reasonably accurate results.

Overall, if heat pipes can transport the power (operating power is below any heat pipe limit), and meet system level thermal considerations (maintain diode temperatures below max operating temperature) they are an ideal solution to improve performance and make more effective use of available volume. The passive operation of heat pipes ensures a highly reliable and energy efficient design. Understanding the limitations, integration and modeling techniques as described above can allow designers to quickly develop a solution using heat pipe technology. Heat pipes can ultimately expand the limitations of conduction or air-cooled systems.

Pumped Two Phase (P2P)

Similar to how heat pipes can expand conduction limitations, Pumped Two-Phase (P2P) is a technique that can expand the heat flux and total power capabilities of liquid cooled solutions. In many applications, laser diode stacks utilize multiple high-power boards, with high heat flux cooling requirements. For example, some vertical-cavity surface emitting lasers (VCSELs) can output heat flux greater than 500 W/cm². P2P can handle such high heat flux due to the latent heat of vaporization, while single phase will have large temperature spikes due to the increased pressure drop it experiences, and the thermal resistance getting heat into the fluid flow. Another requirement that limits the suitability of single-phase liquid cooling for laser-based applications is the need for temperature uniformity across arrays of laser diodes. In a single-phase system, the heat input will raise the temperature of the fluid across the system, while in a P2P system, the latent heat of vaporization can be leveraged to provide uniformity; the quality (mass fraction of the fluid that is vapor) is increased while temperature of the cold plate remains relatively stable.

Finally, from a system level perspective, P2P will offer packaging advantages over single-phase pumped liquid cooling. A single-phase system relies on flow rate to increase the heat transfer coefficient, which drives pump size. Comparatively, P2P relies on boiling heat transfer and therefore can operate efficiently with much smaller pumps. Similarly, many single-phase laser diode coolers are utilizing extremely small channels (microchannels), which leads to high pressure drop and shorter pump lifetimes. P2P systems, due to the boiling heat transfer, can be designed with larger channels to avoid high localized pressure. A depiction of a basic P2P system is shown in Figure 5. A P2P cooling loop is comprised of (at minimum) a cold plate/ evaporator which contacts the heat generating components, a condenser to dissipate heat and condense the two-phase fluid back to liquid, an accumulator for fluid storage and inventory, and the pump.

When designing a P2P system, the fluid choice is fairly straightforward. While two-phase mechanisms are well-suited for high heat flux cooling, they are susceptible to flow and thermal instabilities. Stability is usually lower for working fluids with smaller ratios of liquid to vapor density. Figure 6 shows a plot of liquid to vapor density ratio vs boiling coefficient[1]. In most fielded systems, dielectric fluids such as R134a are chosen due to their operating temperature and reliability.

Another important design consideration is the Critical Heat Flux (CHF). With flow boiling, vapor quality plays an important role to characterize the flow inside channels. Saturated flow boiling in channels is governed by two mechanisms: nucleate boiling and forced convection boiling. Flow regimes and the heat transfer coefficient along a uniformly heated channel for these conditions is shown in Figure 7. An increase in the vapor quality corresponds to the formation of more bubbles inside a channel and in turn increases the risk of covering the heated surface by a blanket of vapor, leading to the point of CHF. CHF will lead to a sharp decrease in the heat transfer coefficient and a corresponding increase in device temperature. To avoid this, the general recommendation is to maintain a vapor quality at the outlet of the channel around 0.3.

            In order to determine heat transfer coefficient (HTC) and ΔP, correlations are used. Due to complexities of physics in two-phase systems, there is no universal correlation to predict these values. Understanding your heat flux, mass flow rate, channel dimensions, etc. are imperative to selecting the most accurate correlation. Some famous correlations for predicting these values are listed below:

Heat Transfer Coefficient

• Chen’s correlations (I&EC Process Design and Development 5 (1966) 322-329)
• Shah’s correlations (ASHRAE Trans. 82 (1976) 66-86)
• Kandlikar’s correlations ( Heat Transfer 112 (1990) 219-228)
• Lee and Mudawar’s correlations (Int. J. Heat Mass Transfer 48 (2005) 941-955)

 Pressure Drop

• Lockhart and Martinelli, ( Eng. Prog. 45 (1949) 39-48)
• Lee and Mudawar, (Int. J. Heat Mass Transfer 48 (2005) 928-940)
• et al., (Int. J. Heat Mass Transfer 53 (2010) 453-465)
• Li and Wu, (Int. J. Heat Mass Transfer 53 (2010) 2732-2739)

In practice, P2P fluid loops have been used for numerous laser diode cooling applications to achieve high heat flux and temperature uniformity requirements. In many practical applications it is required or desirable to have the evaporators configured in parallel. This often raises the question of transient response and temperature stability during component on/off periods. In the example shown in Figure 8, an experiment was designed using parallel flow channels to demonstrate thermal response to high heat flux sources being intermittently turned on/off. The resultant temperature and flow rate response is shown below the test setup. At t=0s, power was applied to all evaporators. At t~200s, power to the yellow and blue evaporator was turned off. At t~400s, power to the blue evaporator was restored and at t~550, power to the yellow evaporator was restored.  The test demonstrated very low temperature fluctuations across the other two continuously powered evaporators (red and orange), and once power was restored the effected evaporator balanced to original performance without overshooting temperature limits or causing system level instabilities.

            In summary, two-phase solutions provide system level thermal benefits by taking advantage of a fluids latent heat of vaporization to efficiently absorb and transport waste heat to the system’s ultimate heat sink. In a low to medium power cooling application, the high effective conductivity (k_eff) achieved by the heat pipe can efficiently spread heat from the source components, taking full advantage of all heat dissipation surfaces. This can allow for higher power, reduce operating temperature or shrink the heat sink footprint in your system. For high power systems, P2P can expand the limits of single-phase cooling by introducing boiling effects instead of relying on fluid velocity to improve heat transfer. This provides higher heat flux and more uniform temperature profiles along a fluid cold plate, providing thermal and packaging advantages for designers.

[1] Forster & Zuber

[2] https://www.1-act.com/resources/pumped-two-phase-cooling/

Acknowledgements:

I would like to thank various members of Advanced Cooling Technologies, Inc. (ACT) engineering team that have contributed to our Heat Pipe and Pumped Two Phase library and experiences: Bill Anderson, Rich Bonner, Devin Pellicone, and Andy Slippey.

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Kuan-LinLee et al., International Conference on Environmental Systems, ICES-2020-201. (2020)

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Lee, K., Tarau, C., Anderson, W.G. et al., Microgravity Science Technology. (2020)

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A Systems Study of a Stirling Convertor based Space Nuclear Power System

Joesph VanderVeer et al., International Energy Conversion Engineering Conference, Indianapolis, IN, August 19-22 2019

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Bradley Richard et al., 49th International Conference on Environmental Systems (ICES), Boston, Massachusetts, July 7-11 2019

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24 Hour Consumable-based Cooling System for Venus Lander

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Advances in Lightweight Heat Sinks

Mohammad Reza Shaeri and Richard Bonner, 4th Thermal & Fluids Engineering Conference, Las Vegas, NV, April 14-17 2019

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A Nonlocal Peridynamics Modeling Approach for Corrosion Damage and Crack Propagation

Srujan Rokkam, et al., Theoretical and Applied Fracture Mechanics, 101, 2019, 373–387 (2019)

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Srujan Rokkam, et al., 6th International Crack Paths Conference, Verona, Italy, September 19-21 2018

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Bio-inspired self-agitator for convective heat transfer enhancement

Zheng Li et al., Applied Physical Letters 113, 113703 (2018)

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Corrosion testing of metals in contact with calcium chloride hexahydrate used for thermal energy storage

S. J. Ren et al., Materials and Corrosion, Volume 68, Issue 10, July 2017

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Bradley Richard et al., 48th International Conference on Environmental Systems, Albuquerque, New Mexico, July 8-12, 2018

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Design Analysis and Performance testing of a Novel Passive Thermal Management System for Future Exploration Missions

Angel R. Alvarez-Hernandez et al., International Conference on Environmental Systems, Albuquerque, NM July 8-12, 2018

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High-Heat-Flux (> 50 W/cm2) Hybrid Constant Conductance Heat Pipes

Mohammed T. Ababneh et al. International Conference on Environmental Systems, Albuquerque, NM, July 8-12, 2018

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Demonstration of Copper-Water Heat Pipes Embedded in High Conductivity (HiK™) Plates in the Advanced Passive Thermal eXperiment (APTx) on the International Space Station (ISS)

Mohammed T. Ababneh et al., International Conference on Environmental Systems, Albuquerque, NM July 8-12, 2018

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Advanced Passive Thermal eXperiment (APTx) for Warm-Reservoir Hybrid-Wick Variable Conductance Heat Pipes on the International Space Station (ISS),”

Calin Tarau, et al., International Conference on Environmental Systems (ICES 2018), Albuquerque, NM July 8-12, 2018

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Apparatus for Characterizing Hot Surface Ignition of Aviation Fuels

Andrew Slippey et al., AIAA Propulsion and Energy Forum, (AIAA 2018-4708), Cincinnati, OH, July 9-12, 2018

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Kuan-Lin Lee, et al., 19th International Heat Pipe Conference, Pisa, Italy, June 10-14, 2018

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Copper-Water and Hybrid Aluminum-Ammonia Heat Pipes for Spacecraft Thermal Control Applications

Mohammed Ababneh, et al., 19th International Heat Pipe Conference, Pisa, Italy, June 10-14, 2018

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Loop Heat Pipe Wick Fabrication via Additive Manufacturing

Bradley Richard, et al., 19th International Heat Pipe Conference, Pisa, Italy, June 10-14, 2018

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Meshless Computational tools for Fatigue Damage and Failure Modeling

Srujan Rokkam et al., ITHERM 2018 (17th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems), San Diego, CA, May 29 – June 1

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Thermal Management Technologies for Embedded Cooling Applications

Andy Slippey et al., ITHERM 2018 (17th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems), San Diego, CA, May 29 – June 1

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Experimental Investigation of Gravity-Driven Two-Phase Cooling for Power Electronics Applications

Devin Pellicone, PCIM 2018, Nuremberg, Germany, June 5-7, 2018.

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Chunjian Pan,⇑, Joshua Charles, Natasha Vermaak, Carlos Romero, Sudhakar Neti, Energy Research Center, Lehigh University, Bethlehem, PA 18015, USA Ying Zheng, Chien-Hua Chen, Richard Bonner III, Advanced Cooling Technologies, Inc., Lancaster, PA 17601, USA International Journal of Heat and Mass Transfer, Accepted 2 April 2018

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A Non-Thermal Gliding Arc Plasma Reformer for Syngas Production

Howard Pearlman, 3rd Thermal and Fluids Engineering Conference (TFEC), Fort Lauderdale, FL, March 4-7, 2018

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An Innovative Volatile Organic Compound Incinerator

Joel Crawmer et al., International Thermal Treatment Technologies (IT3), Houston, TX, March 6-8 2018

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Developing High-Temperature Water-Repellent Glass Fibers Through Atomic Layer Deposition

Mohammad Reza Shaeri et al., 3rd Thermal and Fluids Engineering Conference (TFEC), Fort Lauderdale, FL, March 4-7, 2018.

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Dropwise Condensation on Hydrophobic Microporous Powder and the Transition to Intrapowder Droplet Removal

Sean Hoenig and Richard W. Bonner, III, 3rd Thermal and Fluids Engineering Conference (TFEC), Fort Lauderdale, FL, March 4-7, 2018.

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The Key Role of Pumping Power in Active Cooling Systems

Mohammed Reza Shaeri, 3rd Thermal and Fluids Engineering Conference (TFEC), Fort Lauderdale, FL, March 4-7, 2018.

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Nucleating agent enhanced thermal desalination at the triple point

Fangyu Cao et al., 3rd Thermal and Fluids Engineering Conference (TFEC), Fort Lauderdale, FL, March 4-7, 2018

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Titanium Water Heat Pipes for Space Fission Power Cooling

Kuan-Lin Lee et al. ANS NETS 2018 – Nuclear and Emerging Technologies for Space Las Vegas, NV, February 26 – March 1, 2018

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Dropwise Condensation on Superhydrophobic Microporous Wick Structures

Sean Hoenig, Richard Bonner, Ph.D., ASME doi:10.1115/1.4038854 History: Received April 28, 2017; Revised December 06, 2017

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A Peridynamics-FEM Approach for Crack Path Prediction in Fiber-Reinforced Composites

Srujan Rokkam et al., 2018 AIAA SciTech Forum, Kissimmee, FL, January 8-12, 2018.

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Vapor chambers with hydrophobic and biphilic evaporators in moderate to high heat flux applications

Mohammad Reza Shaeri, Daniel Attinger, Richard W. Bonner III, Applied Thermal Engineering, Volume 130(5), Pages 83-92, February 2018

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Efficient optimization of a longitudinal finned heat pipe structure for a latent thermal energy storage system

Sean Hoenig et al., Energy Conversion and Management, 153, pp. 93-105, 2017.

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Clayton Hose et al., InterPACK 2017, San Francisco, CA, August 29 – September 1, 2017

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Heat transfer and pressure drop in laterally perforated-finned heat sinks across different flow regimes

Mohammad Reza Shaeri, Richard Bonner Advanced Cooling Technologies, Inc., Lancaster, PA 17601, United States , Available online 24 August 2017

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Mohammad Reza Shaeria et al., International Communications in Heat and Mass Transfer, Vol. 86, pp. 199–205, 2017.

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Mohammed Reza Shaeri, and Richard W. Bonner III, ASME 2017 Summer Heat Transfer Conference (HT2017), July 9-14, 2017, Bellevue, Washington, USA

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Two-Phase Heat Exchanger with Thermal Storage Capability for Space Thermal Control System

Two-Phase Heat Exchanger with Thermal Storage Capability for Space Thermal Control System, Kuan-Lin Lee, et al. 47th International Conference on Environmental Systems (ICES 2017), July 16-20, 2017, Charleston, South Carolina

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Advanced Passive Thermal Experiment for Hybrid Variable Conductance Heat Pipes and HiK™ Plates on the International Space Station

Advanced Passive Thermal Experiment for Hybrid Variable Conductance Heat Pipes and HiK™ Plates on the International Space Station, Mohammed T. Ababneh, et al. 47th International Conference on Environmental Systems (ICES 2017), July 16-20, 2017, Charleston, South Carolina

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LHP Wick Fabrication via Additive Manufacturing

LHP Wick Fabrication via Additive Manufacturing. Bradley Richard, et al. 47th International Conference on Environmental Systems (ICES 2017), July 16-20, 2017, Charleston, South Carolina

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High Temperature Water Heat Pipes for Kilopower System

Derek Beard et al., IECEC – AIAA Propulsion and Energy Forum and Exposition (AIAA Propulsion and Energy 2017), July 10-12, Atlanta, Georgia

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Sodium Heat Pipes for Space and Surface Fission Power

Derek Beard, Calin Tarau, and William G. Anderson, IECEC – AIAA Propulsion and Energy Forum and Exposition (AIAA Propulsion and Energy 2017), July 10-12, Atlanta, Georgia

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Laminar Forced Convection Heat Transfer From Laterally Perforated-Finned Heat Sinks

Mohammad Reza Shaeri and Richard W. Bonner III, Applied Thermal Engineering, Volume 116, pp. 406-418, April 2017.

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An Innovative Volatile Organic Compound Incinerator

Joel Crawmer et al., 10th U. S. National Combustion Meeting, College Park, MD, April 23-26, 2017

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A Swiss Roll Style Combustion Reactor for Non-Catalytic Reforming

Ryan Zelinsky et al., 10th U. S. National Combustion Meeting, College Park, MD, April 23-26, 2017

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Thermal Resistance Network Model for Heat Pipe-PCM Based Cool Storage System

Sean Hoenig et al., 2nd Thermal and Fluid Engineering Conference (TFEC2017), Las Vegas, NV, April 2-5 2017.

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Development of Low Cost Radiator for Surface Fission Power

Calin Tarau et al., International Energy Conversion Engineering Conference (IECEC), Salt Lake City, UT, July 25-27, 2016

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Generation of amorphous carbon models using liquid quench method: A reactive molecular dynamics study.

Raghavan Ranganathan, Srujan Rokkam, Tapan Desai, Pawel Keblinski Carbon, Volume 113, March 2017, Pages 87–99

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Self-Venting Arterial Heat Pipes for Spacecraft Applications

Derek Beard, William G. Anderson, and Calin Tarau, International Energy Conversion Engineering Conference (IECEC), Salt Lake City, UT, July 25-27, 2016

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Hybrid Heat Pipes for Lunar and Martian Surface and High Heat Flux Space Applications

Mohammed T. Ababneh et al., International Conference on Environmental Systems (ICES) 2016, Vienna. Austria, July 11-14, 2016

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Development of a Pumped Two-phase System for Spacecraft Thermal Control

Michael C. Ellis and Richard C. Kurwitz, International Conference on Environmental Systems (ICES) 2016, Vienna. Austria, July 11-14, 2016

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Vapor Chamber with Phase Change Material-Based Wick Structure

James Yun, Calin Tarau, and Nathan Van Velson, International Conference on Environmental Systems (ICES) 2016, Vienna. Austria, July 11-14, 2016

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A Novel Closed System, Pressure Controlled Heat Pipe Design for High Stability Isothermal Furnace Liner Applications

Taylor Maxwell et al., 13th International Symposium on Temperature and Thermal Measurements in Industry and Science (TEMPMEKO 2016), Zakopane, Poland, June 26 – July 1, 2016

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Thermal Enhancements for Separable Thermal Mechanical Interfaces

James Schmidt et al., AIAA Thermophysics Conference, Washington, D.C., June 13-17, 2016

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The Design of a Split Loop Thermosyphon Heat Exchanger for Use in HVAC Applications

Daniel Reist et al., Joint 18th International Heat Pipe Conference and 12th International Heat Pipe Symposium, Jeju, Korea, June 12-16, 2016

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Hot Reservoir Stainless-Methanol Variable Conductance Heat Pipes for Constant Evaporator Temperature in Varying Ambient Conditions

Jens Weyant et al., Joint 18th International Heat Pipe Conference and 12th International Heat Pipe Symposium, Jeju, Korea, June 12-16, 2016

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Hybrid Variable and Constant Conductance Heat Pipes for Lunar and Martian Environments and High Heat Flux Space Applications

Mohammed T. Ababneh et al., Joint 18th International Heat Pipe Conference and 12th International Heat Pipe Symposium, Jeju, Korea, June 12-16, 2016

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Self-Venting Arterial Heat Pipes for Spacecraft Applications

William G. Anderson et al., Joint 18th International Heat Pipe Conference and 12th International Heat Pipe Symposium, Jeju, Korea, June 12-16, 2016

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Performance Life Testing of a Nanoscale Coating for Erosion and Corrosion Protection in Copper Microchannel Coolers

Nathan Van Velson and Matt Flannery, IEEE ITherm Conference, May 31-June 3, 2016, Las Vegas, NV

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Heat Pipes used as Heat Flux Transformers and for Remote Heat Rejection

Devin Pellicone and Jens Weyant, PCIM Europe 2016, Nuremberg, Germany, May 10-12, 2016

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Enhanced Filmwise Condensation with Thin Porous Coating

Ying Zheng, Chien-Hua Chen, Howard Pearlman, Richard Bonner, First Pacific Rim Thermal Engineering Conference, PRTEC, March 13-17, 2016, Hawaii's Big Island, USA.

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Optimized Alkali Metal Backup Cooling System Tested with a Stirling Convertor

Calin Tarau, Nuclear and Emerging Technologies for Space (NETS) 2016, Huntsville, AL, February 22-25, 2016.

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Status of the Development of Low Cost Radiator for Surface Fission Power II

Calin Tarau, Nuclear and Emerging Technologies for Space (NETS) 2016, Huntsville, AL, February 22-25, 2016.

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Passivation and Stabilization of Aluminum Nanoparticles for Energetic Materials

Matthew Flannery, Journal of Nanomaterials, vol. 2015, Received 17 June 2015; Accepted 13 October 2015

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Modeling high-temperature diffusion of gases in micro and mesoporous amorphous carbon

Raghavan Ranganathan, Srujan Rokkam, Tapan Desai, Pawel Keblinski, Peter Cross, and Richard Burnes, The Journal of Chemical Physics 143, 084701 (2015).

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Optimized Heat Pipe Backup Cooling System Tested with a Stirling Convertor

Carl L. Schwendeman, Calin Tarau, Nicholas A. Schifer, John Polak, and William G. Anderson, 13th International Energy Conversion Engineering Conference (IECEC), Orlando, FL, CA, July 27-29, 2015.

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Status of the Low-Cost Radiator for Fission Power Thermal Control

Taylor Maxwell, Calin Tarau, William G. Anderson, Scott Garner, Matthew Wrosch, and Maxwell H. Briggs, 13th International Energy Conversion Engineering Conference (IECEC), Orlando, FL, CA, July 27-29, 2015.

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Water-Titanium Heat Pipes for Spacecraft Fission Power

Rebecca Hay and William G. Anderson, 13th International Energy Conversion Engineering Conference (IECEC), Orlando, FL, CA, July 27-29, 2015.

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Two-Phase Thermal Switch for Spacecraft Passive Thermal Management

Nathan Van Velson, Calin Tarau, and William G. Anderson, 45th International Conference on Environmental Systems (IECS), Bellevue, WA, July 12-16, 2015.

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Multiple Loop Heat Pipe Radiator for Variable Heat Rejection in Future Spacecraft

Nathan Van Velson, Calin Tarau, Mike DeChristopher, and William G. Anderson, 45th International Conference on Environmental Systems (IECS), Bellevue, WA, July 12-16, 2015.

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Hybrid Heat Pipes for Planetary Surface and High Heat Flux Applications

Mohammed T. Ababneh, Calin Tarau, and William G. Anderson, 45th International Conference on Environmental Systems (IECS), Bellevue, WA, July 12-16, 2015.

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Experimental Investigation on the Thermal and Hydraulic Performance of Alumina–Water Nanofluids in Single-Phase Liquid-Cooled Cold Plates

Ehsan Yakhshi-Tafti, Sanjida Tamanna and Howard Pearlman, Journal of Heat Transfer, Vol. 137, July 1, 2015

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A “Swiss-Roll” Fuel Reformer: Experiments and Modeling

Chien-Hua Chen, Bradley Richard, Ying Zheng, Howard Pearlman, Shrey Trivedi, Srusti Koli, Andrew Lawson, and Paul Ronney, “A “Swiss-Roll” Fuel Reformer: Experiments and Modeling,” 9th U. S. National Combustion Meeting, Cincinnati, OH, May 17-20, 2015.

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Effect of Porous Coating on Condensation Heat Transfer

Ying Zheng, Chien-hua Chen, Howard Pearlman, Matt Flannery and Richard Bonner. 9th International Conference on Boiling and Condensation Heat Transfer, April 26-30, 2015, Boulder, Colorado.

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High Temperature Water-Titanium Heat Pipes for Spacecraft Fission Power

Rebecca Hay and William G. Anderson, Nuclear and Emerging Technologies for Space (NETS-2015), Albuquerque, NM, February 23-26, 2015.

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Nanoscale Coating for Microchannel Cooler Protection in High Powered Laser Diodes

Tapan Desai, Matthew Flannery, Nathan Van Velson, and Philip Griffin, “Nanoscale Coating for Microchannel Cooler Protection in High Powered Laser Diodes,” Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2015), San Jose, CA, March 16-19, 2015.

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Fuel-Flexible Hybrid Solar Coal Gasification Reactor

M. Flannery et al., "Fuel-Flexible Hybrid Solar Coal Gasification Reactor," 2014 Pittsburgh Coal Conference, Pittsburgh, PA, October 6 - 9, 2014.

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Heat Pipe Embedded Carbon Fiber Reinforced Polymer Composite Enclosures for Avionics Thermal Management

Andrew Slippey, Michael C. Ellis, Bruce Conway, and Hyo Chang Yun. SAE 2014 Aerospace Systems and Technology Conference, Cincinnati, OH, September 23-25, 2014.

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Passive Thermal Management for Avionics in High Temperature Environments

Michael C. Ellis, William G. Anderson, and Jared R. Montgomery. SAE 2014 Aerospace Systems and Technology Conference, Cincinnati, OH, September 23-25, 2014.

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Passivation of Aluminum Nanoparticles by Plasma-Enhanced Chemical Vapor Deposition for Energetic Nanomaterials

T. Desai et al., ACS Applied Materials and Interfaces Journal, 2014, 6 (10), pp. 7942–7947, DOI: 10.1021/am5012707

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Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes

Ababneh, Mohammed T., Shakti Chauhan, Pramod Chamarthy, and Frank M. Gerner. "Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes." Journal of Heat Transfer 136, no. 11 (2014): 112901.

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Launch Vehicle Avionics Passive Thermal Management

W. G. Anderson et al., “Launch Vehicle Avionics Passive Thermal Management,” 44th International Conference on Environmental Systems (ICES 2014), Tucson, AZ, July 13-17, 2014.

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Low Cost Radiator for Fission Power Thermal Control

Taylor Maxwell et al, 12th International Energy Conversion Engineering Conference (IECEC), Cleveland, OH, July 28-30, 2014.

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Flow Boiling Heat Transfer Enhancement in Subcooled and Saturated Refrigerants in Minichannel Heat Sinks

E. Yakhshi-Tafti et al., ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting and 12th International Conference on Nanochannels, Microchannels, and Minichannels, August 3-7, 2014, Chicago, IL.

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Thermal-Fluid Modeling for High Thermal Conductivity Heat Pipe Thermal Ground Planes

M. T. Ababneh et al., published in the AIAA Journal of Thermophysics and Heat Transfer, Vol. 28, No. 2, pp. 270-278, April 2014.

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Thermoelectric Performance Model Development and Validation for a Selection and Design Tool

Thomas Nunnally, Devin Pellicone, Nathan Van Velson, James Schmidt, Tapan Desai, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014.

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High Heat Flux Heat Pipes Embedded in Metal Core Printed Circuit Boards for LED Thermal Management

Dan Pounds, Richard W. Bonner III, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014

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Enhancing Thermal Performance in Embedded Computing for Ruggedized Military and Avionics Applications

Darren Campo, Jens Weyant, Bryan Muzyka, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014.

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A Corrosion and Erosion Protection Coating for Complex Microchannel Coolers used in High Power Laser Diodes

Tapan G. Desai, Matthew Flannery, Angie Fan, Jens Weyant, Henry Eppich, Keith Lang, Richard Chin, and Aland Chin, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014

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The Thermal Conductivity of Clustered Nanocolloids

T. Desai et al., APL Materials, 2, 066102 (2014); doi: 10.1063/1.4880975. 21 May 2014;

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Diffuse interface modeling of void growth in irradiated materials. Mathematical, thermodynamic and atomistic perspectives

Anter El-Azab Karim Ahmed, Srujan Rokkam, Thomas Hochrainer, Published in Current Opinion in Solid State and Materials Science (COSSMS), Vol. 18, pg. 90-98, 2014.

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Effect of Crosslink Formation on Heat Conduction in Amorphous Polymers

Gota Kikugawa, Tapan G. Desai, et al., Journal of Applied Physics 114, published online July 16, 2013

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Variable Conductance Heat Pipe Cooling of Stirling Convertor and General Purpose Heat Source

Calin Tarau, et al.,11th International Energy Conversion Engineering Conference (IECEC), San Jose, CA, July 15-17, 2013.

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High Temperature Heat Pipes for Space Fission Power

Kara L. Walker, et al.,11th International Energy Conversion Engineering Conference (IECEC), San Jose, CA, July 15-17, 2013.

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Variable Conductance Heat Pipe Radiator for Lunar Fission Power Systems

William G. Anderson, et al., 11th International Energy Conversion Engineering Conference (IECEC), San Jose, CA, July 15-17, 2013.

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Ammonia and Propylene Loop Heat Pipes with Thermal Control Valves – Thermal/Vacuum and Freeze/Thaw Testing

Kara Walker, et al., 43rd International Conference on Environmental Systems (ICES 2013), Vail, CO, July 14-18, 2013.

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Intermediate Temperature Heat Pipe Life Tests and Analyses

W. G. Anderson, et al., 43rd International Conference on Environmental Systems (ICES 2013), Vail, CO, July 14-18, 2013

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Correlation for dropwise condensation heat transfer: Water, organic fluids, and inclination

Richard W. Bonner III, International Journal of Heat and Mass Transfer, Volume 61, June 2013, Pages 245-253

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A Non-Catalytic Fuel-Flexible Reformer

Chien-Hua Chen, et al., 8th U. S. National Combustion Meeting, hosted by the University of Utah, May 19-22, 2013

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Planar vapor chamber with hybrid evaporator wicks for the thermal management of high-heat-flux and high-power optoelectronic devices

P. Dussinger et al., International Journal of Heat and Mass Transfer, Volume 60, pp. 163–169, May 2013.

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Variable Conductance Thermal Management System for Balloon Payloads

Calin Tarau and William G. Anderson, 20th AIAA Lighter-Than-Air Systems Technology Conference, Daytona Beach, FL, March, 25-28, 2013

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Preliminary First Principle Based Electro-thermal Coupled Solver for Silicon Carbide Power Devices

Angie Fan et al., 29th IEEE SEMI-THERM Symposium, San Jose, CA, March 17-21, 2013

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Variable Conductance Heat Pipe Radiator Trade Study for Lunar Fission Power Systems

William G. Anderson, Bryan J. Muzyka, and John R. Hartenstine, Nuclear and Emerging Technologies for Space (NETS-2013), Albuquerque, NM, February 25-28, 2013.

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Alkali Metal Backup Cooling for Stirling Systems – Experimental Results

Carl Schwendeman, Calin Tarau, William G. Anderson, and Peggy A. Cornell, Nuclear and Emerging Technologies for Space (NETS-2013), Albuquerque, NM, February 25-28, 2013.

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Alkali Metal Heat Pipes for Space Fission Power

Kara L. Walker, Calin Tarau, and William G. Anderson, Nuclear and Emerging Technologies for Space (NETS-2013), Albuquerque, NM, February 25-28, 2013.

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Syngas Production by Thermochemical Conversion of CO2 and H2O Using a High-Temperature Heat Pipe Based Reactor

H. Pearlman and Chien-Hua Chen, SPIE Solar Hydrogen and Nanotechnology VII, Proceedings of SPIE Vol. 8469 San Diego, CA, August 12-14, 2012.

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Diode Heat Pipes for Venus Landers

Calin Tarau et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), San Diego, CA, July 31 - August 3, 2012.

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Long-Lived Venus Lander Thermal Management System Design

Rebecca Hay et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), Atlanta, GA, July 30 July-August 1, 2012.

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Variable Conductance Heat Pipes for Variable Thermal Links

W. G. Anderson et al., 42nd International Conference on Environmental Systems (ICES 2012), San Diego, CA, July 15-19, 2012.

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Pressure Controlled Heat Pipe Applications

W. G. Anderson et al., 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012.

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The Effect of Device Level Modeling on System-Level Thermal Predictions

Jens Weyant, et al., ITherm, San Diego, CA, May 30, 2012,

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Integration of a Phase Change Material for Junction-Level Cooling in GaN Devices

Daniel Piedra, et al., Semitherm, San Jose, CA, March 2012

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An Innovative Passive Cooling Method for High Performance Light-emitting Diodes

Angie Fan, et al., Semitherm, San Jose, CA, March 2012

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Ultra High Temperature Isothermal Furnace Liners (IFLs) For Copper Freeze Point Cells

Peter Dussinger and John Tavener, 9th International Temperature Symposium, Anaheim, CA, March 2012

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High Heat Flux, High Power, Low Resistance, Low CTE Two-Phase Thermal Ground Planes for Direct Die Attach Applications

Peter Dussinger, et al., GOMACTech 2012, Las Vegas, Nevada, March 2012

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Passive Control of a Loop Heat Pipe with Thermal Control Valve for Lunar Lander Application

K. L. Walker et al., 42nd International Conference on Environmental Systems (ICES 2012), San Diego, CA, July 15-19, 2012.

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A Computational Model of a Phase Change Material Heat Exchanger in a Vapor Compression System with a Large Pulsed Heat Load

G. Troszak and X. Tang, Proceedings of the ASME 2012 Summer Heat Transfer Conference, Puerto Rico, July 8-12, 2012.

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2-D Simulation of Hot Electron-Phonon Interactions in a Submicron Gallium Nitride Device Using Hydrodynamic Transport Approach

Angie Fan et al., ASME 2012 Summer Heat Transfer Conference, Puerto Rico, USA , July 8-12, 2012

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Novel Junction Level Cooling in Pulsed GaN Devices

Tapan G. Desai, et al., ITherm, San Diego, CA, May 30, 2012,

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Intermediate Temperature Heat Pipe Life Tests

W. G. Anderson, et al., 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012.

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Passivation Coatings for Micro-channel Coolers

Richard W. Bonner III, Jens Weyant, Evan Fleming, Kevin Lu, Daniel Reist, APEC 2012, Orlando FL, February 1, 2012

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Pressure Controlled Heat Pipe Solar Receiver for Regolith Oxygen Production with Multiple Reactors

John Hartenstine, et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), San Diego, CA, July 31 - August 3, 2011

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Thermal Management System for Long-Lived Venus Landers

Calin Tarau, et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), San Diego, CA, July 31 - August 3, 2011

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Pressure Controlled Heat Pipes

William Anderson, et al., 41st International Conference on Environmental Systems, Portland, OR, July 17-21, 2011

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Variable Conductance Heat Pipe for a Lunar Variable Thermal Link

Chris Peters, et al., 41st International Conference on Environmental Systems, Portland, OR, July 17-21, 2011

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Two-Phase Heat Sinks with Microporous Coating

T. Semenic and S. M. You, 9th International Conference on Nanochannels, Microchannels, and Minichannels, Edmonton, CA, June 19-22, 2011

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Die Level Thermal Storage for Improved Cooling of Pulsed Devices

Richard Bonner III, et al., Semitherm, San Jose, CA., March 2011

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A 2-D Numerical Study of Microscale Phase Change Material Thermal Storage for GaN Transistor Thermal Management

Xudong Tang, et al., Semitherm, San Jose, CA, March 2011

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Dynamic Response of Phenolic Resin and Its Carbon-nanotube Composites to Shock Wave Loading

Arman, et. al., Journal of Applied Physics, 109, 013503 (2011)

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Loop Heat Pipe with Thermal Control Valve for Variable Thermal Conductance Link of Lunar Landers and Rovers

Loop Heat Pipe with Thermal Control Valve for Variable Thermal Conductance Link of Lunar Landers and Rovers, J. R. Hartenstine et al., 49th AIAA Aerospace Sciences Meeting, Orlando, FL, January 4-7, 2011.

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Electronics Cooling Using High Temperature Loop Heat Pipes with Multiple Condensers

William G. Anderson, et al., SAE Power Systems Conference, Ft. Worth, TX, November 2010

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Development of Heat Pipe Loop Technology for Military Vehicle Electronics Cooling

Xudong Tang et al., NDIA Ground Vehicle Systems Engineering and Technology Symposium, Dearborn, Michigan, August 2010

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Dropwise Condensation Life Testing of Self Assembled Monolayers

Richard Bonner III, IHTC14, Washington, DC, August 2010

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Heat and Mass Transfer in a Permeable Fabric system Under Hot Air Jet Impingement,

Sangsoo Lee et. al., International Heat Transfer Conference (IHTC14), Washington, DC, August, 2010

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Variable Thermal Conductance Link for Lunar Landers and Rovers

William G Anderson et. al., IECEC, Nashville, Tennessee, July, 2010

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Sodium Variable Conductance Heat Pipe for Radioisotope Stirling Systems – Design and Experimental Results

Calin Tarau and William G Anderson, IECEC, Nashville, Tennessee, July, 2010

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Sodium Variable Conductance Heat Pipe with Carbon-Carbon Radiator for Radioisotope Stirling Systems

Calin Tarau and William G. Anderson, 15th International Heat Pipe Conference, Clemson, SC, April 2010

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Low-Temperature, Dual Pressure Controlled Heat Pipes for Oxygen Production from Lunar Regolith

Kara Walker et al., 15th International Heat Pipe Conference, Clemson, South Carolina, April, 2010

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Intermediate Temperature Fluids for Heat Pipes and Loop Heat Pipes

William G. Anderson, John R. Hartenstine, David B. Sarraf, and Calin Tarau, Advanced Cooling Technologies, Inc., Pennsylvania, 15th International Heat Pipe Conference (15th IHPC) Clemson, USA, April 25-30, 2010.

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Dropwise Condensation in Vapor Chambers

Richard Bonner, 26th IEEE Semi-Therm Symposium, Santa Clara, California, February 2010

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Sodium VCHP with Carbon-Carbon Radiator for Radioisotope Stirling Systems,

Calin Tarau, et al., Space, Propulsion and Energy Sciences International Forum (SPESIF), Laurel, Maryland, February 2010

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Advanced VCS Evaporators for Lunar Lander and Lunar Habitat Thermal Control Applications

Tadej Semenic, Space, Propulsion and Energy Sciences International Forum (SPESIF), Laurel, Maryland, February 2010

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Modeling Initial Stage of Phenolic Pyrolysis: Graphitic Precursor Formation and Interfacial Effects

Tapan Desai, et al., Polymer, 52, 2010

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Slip Behavior at Ionic Solid-fluid Interfaces

Tapan Desai, NDIA Chemical Physics Letters, 501, 2010, 93-97

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Roles of Atomic Restructuring in Interfacial Phonon Transport

Seungha Shin et. al., Physical Review B, 82, 081302 (2010)

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Anisotropic Shock Response of Columnar Nanocrystalline Cu

Sheng-Nian Luo et. al., Journal of Applied Physics , 107, 123507 (2010)

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Heat Pipe Embedded Alsic Plates for High Conductivity-Low CTE Heat Spreaders

J. Weyant, ITHERM 2010, Las Vegas NV,

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Pressure Controlled Heat Pipe Solar Receiver for Oxygen Production from Lunar Regolith

John R. Hartenstine, et al., AIAA Aerospace Sciences Meeting, Orlando, Florida, January 2010

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Sodium Variable Conductance Heat Pipe for Radioisotope Stirling Systems

Calin Tarau, et al., 7th International Energy Conversion Engineering Conference, Denver Colorado, August 2009

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Loop Heat Pipe Design, Manufacturing and Testing – an Industrial Perspective

William Anderson, et al., ASME 2009 Heat Transfer Summer Conference, San Francisco, California, July 2009

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Dropwise Condensation on Surfaces with Graded Hydrophobicity

Richard Bonner, ASME 2009 Heat Transfer Summer Conference, San Francisco, California, July 2009

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Evaporators for High Temperature Lift Vapor Compression Loop for Space Applications

Tadej Semenic and Xudong Tang, ASME 2009 Heat Transfer Summer Conference, San Francisco, California, July 2009

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Variable Conductance Heat Pipe Radiators for Lunar and Martian Environments

William Anderson, et al., Space, Propulsion and Energy Sciences International Forum (SPESIF), Huntsville, Alabama, February 2009

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High Temperature Variable Conductance Heat Pipes for Radioisotope Stirling Systems

Calin Tarau, et al., Space, Propulsion and Energy Sciences International Forum (SPESIF), Huntsville, Alabama, February 2009

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Heat Pipe Solar Receiver for Oxygen Production of Lunar Regolith

John Hartenstine, et al., Space, Propulsion and Energy Sciences International Forum (SPESIF), Huntsville, Alabama, February 2009

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Variable Conductance Heat Pipe Performance after Extended Periods of Freezing

Michael Ellis and William Anderson, Space, Propulsion and Energy Sciences International Forum (SPESIF), Huntsville, Alabama, February 2009

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Loop Heat Pipe for TacSat-4

Peter Dussinger, et al., Space, Propulsion and Energy Sciences International Forum (SPESIF), Huntsville, Alabama, February 2009

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Advanced Thermal Management Technologies for High Power Automotive Equipment

Jon Zuo, et al., National Defense Industrial Association Ground Vehicle Power and Energy Workshop, Troy, Michigan, November 2008

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Vibration and Shock Tolerant Capillary Two-Phase Loop Technology for Vehicle Thermal Control

Xudong Tang and Chanwoo Park, 2008 ASME Summer Heat Transfer Conference, Jacksonville, Florida, August 2008

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NaK Variable Conductance Heat Pipe for Radioisotope Stirling Systems

Calin Tarau, et al., 6th International Energy Conversion Engineering Conference (IECEC), Cleveland, Ohio, July 2008

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Heat Pipe Cooling of Concentrating Photovoltaic (CPV) Systems

William Anderson, et al., 6th International Energy Conversion Engineering Conference (IECEC), Cleveland, Ohio, July 2008

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Startup Characteristics and Gravity Effects on a Medium/High-Lift Heat Pump Using Advanced Hybrid Loop Technology

Eric Sunada, et al., 38th SAE International Conference on Environmental Systems, San Francisco, California, June 2008

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High Temperature and High Heat Flux Thermal Management for Electronics

David Sarraf and William Anderson, IMAPS International Conference on High Temperature Electronics Conference (HiTEC 2008), Albuquerque, New Mexico, May 2008

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Heat Pipe Cooling of Concentrating Photovoltaic Cells

William Anderson, et al., 33rd IEEE Photovoltaic Specialists Conference, San Diego, California, May 2008

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Local Heat Transfer Coefficient Measurements of Flat Angled Sprays Using Thermal Test Vehicle

Richard Bonner, et al., 24th IEEE Semi-Therm Symposium, San Jose, California, March 2008

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Pressure Controlled Heat Pipe for Precise Temperature Control

David Sarraf, et al., Space Technology and Applications International Forum (STAIF), Albuquerque, New Mexico, February 2008

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Titanium Loop Heat Pipes for Space Nuclear Power Systems

John Hartenstine, et al., Space Technology and Applications International Forum (STAIF), Albuquerque, New Mexico, February 2008

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Variable Conductance Heat Pipes for Radioisotope Stirling Systems

William Anderson and Calin Tarau, Space Technology and Applications International Forum (STAIF), Albuquerque, New Mexico, February 2008

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Vapor Compression Hybrid Two-Phase Loop Technology for Lunar Surface Applications

Chanwoo Park and Eric Sunada, Space Technology and Applications International Forum (STAIF), Albuquerque, New Mexico, February 2008

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Experimental Study of Oscillating Flow Heat Transfer

Angie Fan, et al., Micro/Nanoscale Heat Transfer International Conference, Tainan, Taiwan, January 2008

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Metal Hydride Heat Storage Technology for Directed Energy Weapon Systems

Chanwoo Park, et al., 2007 ASME International Mechanical Engineering Congress & Exhibition, Seattle, Washington, November 2007

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Electronics Thermal Management Using Advanced Hybrid Two-Phase Loop Technology

Chanwoo Park, et al., 2007 ASME-JSME Thermal Engineering Summer Heat Transfer Conference, Vancouver, Canada, July 2007.

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Loop Thermosyphon Design for Cooling of Large Area, High Heat Flux Sources

John Hartenstine, et al., InterPACK 2007, Vancouver, Canada, July 2007.

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Heat Pipes for High Temperature Thermal Management

David Sarraf and William Anderson, InterPACK 2007, Vancouver, Canada, July 2007.

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Intermediate Temperature Fluids for Heat Pipes and Loop Heat Pipes

William Anderson, 2007 International Energy Conversion Engineering Conference, St. Louis, MO, June 2007.

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Intermediate Temperature Fluids Life Tests – Experiments

William Anderson, et al., 2007 International Energy Conversion Engineering Conference, St. Louis, MO, June 2007.

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Intermediate Temperature Fluids Life Tests – Theory

Calin Tarau, et al., Space Technology and Applications International Forum (STAIF), Albuquerque, NM, February 11 - 15, 2007.

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Spacecraft Thermal Management Using Advanced Hybrid Two-Phase Loop Technology

Chanwoo Park, et al., Space Technology and Applications International Forum (STAIF), Albuquerque, NM, February 11 - 15, 2007.

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Advanced Hybrid Cooling Loop Technology for High Performance Thermal Management

Chanwoo Park, et al., 2006 International Energy Conversion Engineering Conference, San Diego, CA, June 2006.

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Heat Pipe Heat Exchanger with Two Levels of Isolation for Environmental Control of Manned Spacecraft Crew Compartment

David Sarraf, 37th International Conference on Environmental Systems, Norfolk, VA, July 17-20, 2006.

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Passive Thermal Management for a Fuel Cell Reforming Process

David Sarraf, et al., 2006 International Energy Conversion Engineering Conference, San Diego, CA, June 2006.

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High Temperature Water-Titanium Heat Pipe Radiator

William Anderson, et al., 2006 International Energy Conversion Engineering Conference, San Diego, CA, June 2006.

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High Temperature Titanium-Water and Monel-Water Heat Pipes

William Anderson, et al., 2006 International Energy Conversion Engineering Conference, San Diego, CA, June 2006.

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High-Temperature Water Heat Pipes

David Sarraf and William Anderson, IMAPS International Conference on High Temperature Electronics, Santa Fe, NM, May 15 - 18, 2006

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High Performance Heat Storage and Dissipation Technology

Chanwoo Park, et al., 2005 ASME International Mechanical Engineering Congress & Exposition (IMECE), Orlando, FL, November 5 - 11, 2005.

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Design and Testing of Titanium/Cesium and Titanium/Potassium Heat Pipes

Peter Dussinger, et al., 2005 International Energy Conversion Engineering Conference (IECEC), San Francisco, CA, August 2005.

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High Temperature Lightweight Heat Pipe Panel Technology Development

Ted Stern and William Anderson, Space Nuclear Conference 2005, San Diego, CA, June 2005.

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Loop Heat Pipe Radiator Trade Study for the 300-550K Temperature Range

William Anderson and Walter Bienert, Space Technology and Applications International Forum (STAIF), Albuquerque, New Mexico, February 2005

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Hybrid Loop Thermal Bus Technology for Vehicle Thermal Management

Chanwoo Park, et al., 24th Army Science Conference, Orlando, FL, November 29 - December 2, 2004

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