ACT Logo
|ADVANCED COOLING TECHNOLOGIES
0
Cart Icon
Contact Us
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • Active Thermal Management Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • Active Thermal Management Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
0
Cart Icon View Cart
Vapor Compression System with PCM HX for Cooling High Power Lasers

ACT has developed an efficient, compact vapor compression system (VCS) that can handle very high pulsed heat loads including those from high-energy lasers and other non-lethal directed energy weapon systems.  Our vapor compression system is unique in that it incorporates thermal energy storage within the system, which in turn enables the system size, weight and power (SWaP) to be substantially reduced.   Peak heat loads are rapidly stored in the latent heat of a phase change material (PCM) and dissipated at a slower rate during longer recharge periods.  In effect, the thermal energy storage “dampens” the heat load that must be handled by the vapor compression system.

At ACT, particular attention has been given to the design, fabrication and testing of the heat exchanger (HX) that incorporates the phase change material.  It has been designed to efficiently transfer large amounts of heat from a liquid coolant into the PCM where it is temporarily stored before being dissipated by the system.

A top-level schematic of a vapor compression system is shown below (left) along with a schematic of a representative pulsed heat load profile (right).  The red area represents the transient high peak loads that need to be managed and the blue region shows the much lower heat load that is taken up by a VCS having thermal energy storage.

Figure 1:  (Left) A schematic of a vapor compression system with integrated thermal energy storage; (Right) A representative transient thermal energy profile showing that the use of thermal energy storage dampens the heat loads that need to be managed by the vapor compression system.

At present, ACT is developing these systems for both ground and air-based platforms.  For more information, contact ACT.

Top Up facing arrow in a square
Page Index
ACT Logo
Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601, USA
(717) 295-6061 Contact Our Experts
linkedin youtube twitter facebook
  • shop products online
  • sitemap
  • privacy policy
  • terms & conditions
  • ISO9001 & AS9100 CERTIFIED, ITAR REGISTERED

Copyright 2025. All rights reserved.