ACT Logo
|ADVANCED COOLING TECHNOLOGIES
0
Cart Icon
Contact Us
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • Active Thermal Management Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • Active Thermal Management Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
0
Cart Icon View Cart

A LOOK AT THE SPACE INDUSTRY – REVIEW FROM THE 35TH NATIONAL SPACE SYMPOSIUM

The 35th National Space Symposium provided a lot of good insights to the space industry. A strong combination of well-established industry leaders and new entrants into the market were introducing innovative designs. Several noticeable advancements include propulsion systems, launch vehicle reusability and micro and CubeSats. There was also a large emphasis on additive manufacturing. This approach allows for complex geometries that can meet mechanical requirements while greatly reducing weight. Several companies touted flight heritage with this technology.

The growth in the space industry is seemingly from both Government (US and International) and Commercial sectors. Although there is a decline in the commercial GEO Satellite market, the growth in LEO Satellites, MEO Satellites and Space Exploration missions puts the market in a healthy position. In fact, Morgan Stanley predicts the Space market will reach $1.1 Trillion by 2040. One of the major factors driving growth is the overwhelming reduction in launch cost from previous years. With more suppliers, lower cost rockets, reusable parts and ride sharing options, it’s never been more cost effective to get new technology to space. The launch cost savings has led to innovation on both the high and low end of the space Vehicle (SV) market. On the high-performance SV side, companies are seemingly investing more into mission capabilities and high reliability whereas on the low-performance SV side, companies are more willing to take risk and develop emerging technologies.

From a thermal perspective the challenge is driven by power, volume and weight constraints. The most asked about thermal technologies at the show were Copper-Water Heat Pipes, Ammonia Heat Pipes and Phase Change Material (PCM). Each of these options can provide high reliability, passive operation while limiting the mass and volume required compared to other solutions.

At ACT, our heat pipes have significant flight experience, while the PCM line has several ongoing programs that are working towards launch. Please contact us for an evaluation of your system, and expect to find engineering support through the design, manufacturing and qualification process.

A special thanks to our valued customers and new contacts that stopped by our booth. We hope everyone had a great show- ACT’s always excited to support the future of the space industry!

Reference: https://www.morganstanley.com/ideas/investing-in-space

Top Up facing arrow in a square
Page Index
ACT Logo
Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601, USA
(717) 295-6061 Contact Our Experts
linkedin youtube twitter facebook
  • shop products online
  • sitemap
  • privacy policy
  • terms & conditions
  • ISO9001 & AS9100 CERTIFIED, ITAR REGISTERED

Copyright 2025. All rights reserved.