Precision Fluid Routing for Direct-to-Chip Two-Phase Cooling

In modern data centers, the shift toward direct-to-chip two-phase cooling demands more than just powerful CDUs and cold plates. It requires a reliable infrastructure to route coolant with precision, safety, and serviceability. That’s where ACT’s manifold solutions come in.

Purpose-built for both overhead and rack-level deployment, ACT’s manifolds ensure seamless integration between facility cooling systems, CDUs, and cold plates. We deliver dielectric refrigerants exactly where they’re needed. With a design focus on low pressure drop, modularity, and easy service access, ACT manifolds support scalable, energy-efficient thermal architectures for your next-generation compute environments.

More Than Plumbing—An Engineered Link in the Thermal Chain

ACT’s manifolds serve as the circulatory system of your two-phase cooling loop. They manage controlled delivery and return of refrigerant across racks, rows, and edge deployments. From hyperscale data centers to single-rack edge nodes, ACT provides fluid distribution solutions that:

Key Advantages

• Ensure uniform refrigerant flow across cold plates
• Minimize pressure loss for improved pump efficiency
• Integrate safely with dielectric two-phase fluids
• Feature tool-less, dry-break connections for fast maintenance
• Support custom configurations and port counts for your architecture

Whether deployed overhead or at the rack level, each manifold is engineered for optimal thermal performance, ease of service, and long-term reliability.

Two Manifold Configurations. One unified cooling strategy.

Overhead Manifolds

Scalable Distribution Across Multi-Rack Environments

ACT’s overhead manifolds are ideal for large-scale deployments where a centralized CDU supplies coolant to multiple racks. Installed above server aisles or along containment structures, these manifolds route dielectric refrigerant to each rack’s rear-mounted manifold, balancing flow across high-density clusters.

Key Features & Benefits

• Compact hose diameters
• Serves up to 10 racks
• Plug-in-play installation with tool-less quick disconnects
• Minimal pressure drop for high efficiency

Rack Manifolds

Rear-Side Distribution for Node-Level Cooling

Mounted on the rear of each server rack, ACT’s rack manifolds connect directly to overhead or in-rack CDUs and distribute refrigerant to cold plates within the servers. These manifolds serve as a clean, accessible interface between facility cooling loops and the chips themselves—ensuring precision thermal delivery while simplifying maintenance.

Key Features & Benefits

• Compact design minimizes rack space claim
• Modular design supports many rack layouts
• Tool-less quick disconnects for ease of installation
• Minimal pressure drop for high efficiency

integrated thermal ecosystems

ACT’s manifold solutions are designed to work seamlessly with our Coolant Distribution Units (CDUs), cold plates, and full-loop two-phase architectures. With each system engineered for reliability, performance, and safety, you can confidently deploy high-efficiency liquid cooling at scale—knowing every connection point is optimized by the experts.