ACT Logo
|ADVANCED COOLING TECHNOLOGIES
0
Cart Icon
Contact Us
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Active Thermal Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Active Thermal Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
    • Research & Development
      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
    • Product Development
    • Space Thermal & Structural Analysis
    • Manufacturing
    • Lifecycle Management
  • Industries
    • Energy
      • Wind Energy
      • Nuclear Energy
      • Power Conversion
      • Energy Storage
      • HVAC Energy Recovery
    • Space
    • HVAC Energy Recovery
    • Defense
    • Medical
    • Data Centers
    • Other
  • Resources
    • Blog
    • Calculators & Selection Tools
      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
      • Heat Pipe Calculator
      • PCM Calculator
      • WAHX Selection Tool
    • Publications
      • Published Articles
      • Patents
      • Technical Papers
    • Learning Center
      • Heat Pipe Learning Center
      • Pumped Two-Phase Learning Center
      • PCM Learning Center
      • HVAC Learning Center
      • Videos
      • eBooks
      • Brochures
      • Case Studies
      • Webinars
    • Find your Rep
  • Shop
    • Sealed Enclosure Coolers
    • Heat Pipe Coolers
      • Heat Pipe Cooler Accessories
    • Heat Sink Coolers
      • Heat Sink Cooler Accessories
    • Thermoelectric Coolers
    • Vapor Compression Coolers
  • About
    • Careers
    • Events
    • News
    • Sustainability
    • ACT Leadership
  • Contact
0
Cart Icon View Cart

ACT Awarded SBIR Phase II funding for MIDS JTRS Thermal Management System

MIDS JTRS Source: Naval-Technology.com

Lancaster, PA, February 11 2020 – The Navy has funded Advanced Cooling Technologies, Inc. (ACT) for Phase II of the Small Business Innovative Research (SBIR) program, “Advanced Cooling Options for Multifunctional Information Distribution System (MIDS) Joint Tactical Radio System (JTRS) Terminals”.  Under this SBIR, ACT is developing an innovative thermal management system for MIDS JTRS terminals that integrates multiple technologies to significantly increase cooling performance while maintaining size, weight, and power (SWaP) of the system. These MIDS JTRS cooling enhancements potentially afford a significant reduction in terminal Total Ownership Cost (TOC) as the US Navy seeks to increase terminal reliability and provide more capabilities to the fleet.

In the Phase I project, ACT worked closely with the MIDS manufacturers (BAE Systems, Rockwell Collins, ViaSat) to perform a detailed analysis evaluating thermal bottlenecks of MIDS JTRS terminals. ACT then assessed the impact of implementing a large number of potential thermal enhancement technologies at each thermal path, as well as on the overall system. To demonstrate the proposed improvements experimentally, a prototype Hi-K (heat pipe) card frame was fabricated and tested, alongside ICE-LokTM (wedge lock) technology. The Phase II portion will focus on continued prototyping, SWaP analysis and Hi-K card frame validation/qualification efforts with MIDS Program Office (MPO) and MIDS manufacturers to enable a “smooth transition” into MIDS Program of Record.

According to Dr. Srujan Rokkam, the Lead Engineer for the project “We are excited to continue the thermal technologies research and development for MIDS. Successful demonstration of ACT’s Hi-K plates in a relevant environment would improve current MIDS terminal reliability and performance. We look forward to working with the MPO and MIDS prime manufactures to realize these common goals”.

ACT Logo
Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601, USA
(717) 295-6061 Contact Our Experts
linkedin youtube twitter facebook
  • shop products online
  • sitemap
  • privacy policy
  • terms & conditions
  • ISO9001 & AS9100 CERTIFIED, ITAR REGISTERED

Copyright 2025. All rights reserved.