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  • Thermal Solutions
    • Passive Thermal Solutions
      • Heat Pipes
        • HiK Plates­™/ Heat Pipe Assemblies
        • Pulsating Heat Pipes
        • Vapor Chambers
        • High Temperature Heat Pipes
      • Loop Thermosyphon
      • Phase Change Based Solutions
        • PCM Heat Sinks
      • Liquid Cold Plates
    • Enclosure Cooling Products
      • HSC (Heat Sink Coolers)
      • HPC (Heat Pipe Coolers)
      • TEC (Thermoelectric Coolers)
      • VCC (Vapor Compression Coolers)
      • Enclosure Cooling Selection Tool
    • Space Thermal Control
      • Constant Conductance Heat Pipes
      • Variable Conductance Heat Pipes
      • Space Copper-Water Heat Pipes
      • Loop Heat Pipes
      • Space VPX
      • Liquid Cooling
    • Active Thermal Management Solutions
      • Liquid Cooling
      • Pumped Two-Phase
      • Liquid-Air HX
      • Tekgard® ECUs
      • Vaphtek™ ECU
      • Tekgard® Chillers
    • Embedded Computing Solutions
      • ICE-Lok®
      • VME/ VPX Card Frames
      • Conduction Cooled Chassis
      • Liquid Cooled Chassis
    • HVAC Energy Recovery
      • AAHX
      • WAHX
  • Engineering Services
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      • Our Research & Development Team
      • Emerging Technology
      • Technical Papers
      • Other Research Interests
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    • Space Thermal & Structural Analysis
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      • HVAC Energy Recovery
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      • AAHX Selection Tool
      • Enclosure Cooling Selection Tool
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Cyclic Medical Device Cooling
Medical device being used.

A customer was developing a device for a medical application. For operation, the device needed to be applied directly to the skin and repeated use could reach uncomfortable temperature for patients. To study the device performance, FEA analysis was run at different conditions to determine where thermal conditions most needed to be addressed. Several scenarios were evaluated. In one case the device was modeled with a thermal conductivity epoxy. In another case air was modeled. The analysis concluded that the device was conduction limited and recommended either adding Phase Change Materials or a heat pipe located near the handle to significantly improve heat transfer. Product is now in the market and customer has returned to ACT for next generation thermal management concepts.

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Advanced Cooling Technologies, Inc.
1046 New Holland Avenue
Lancaster, Pennsylvania 17601, USA
(717) 295-6061 Contact Our Experts
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