ASME Interpack

October 28 - October 30

ACT Engineer Oveis Shaeri will be presenting:

3D-Printed Condensers with Gradient Wick Structures to Enhance Filmwise Condensation

Details

Start:: October 28
End:: October 30
Event Category:: Presenting
Website:: https://interpack.secure-platform.com/a

Organizer

: ASME Power Division
: View Organizer Website

Venue

: Hotel FERA
: 100 The City Dr S
Orange, CA 92868 United States + Google Map
Phone: (714) 634-4500
: View Venue Website

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