October 24 - October 26
Since 1992, InterPACK has been a premier international conference for the exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronics and photonics packaging and heterogeneous integrated systems.
ACT Engineers will be presenting two papers:
Oveis Shaeri will be presenting Additively Manufactured Hybrid Two-Phase Cold Plate.
Ramy Abdelmaksoud will be presenting Development of Ceramic Pulsating Heat Pipes for Medium-Voltage Planar Magnetic Transformers.