SC26

Visit us at Booth 853 at SC26 in Chicago to explore advanced two-phase direct-to-chip liquid cooling solutions engineered for extreme AI and HPC workloads. By leveraging phase-change heat transfer at the cold plate, our architecture efficiently manages high heat flux and escalating rack power densities while maintaining tight junction temperature control. Designed for scalability and seamless data center integration, our systems enable higher compute performance, improved energy efficiency, and reliable operation in next-generation high-density environments.