In the relentless quest for peak performance, Coolant Distribution Units (CDUs) have become the cornerstone of modern data center thermal management. These advanced systems deliver precise cooling directly to high-density racks and power-intensive chips. More than just components, CDUs form the backbone of next-generation liquid cooling architectures and are strategic enablers of tomorrow’s high-performance computing. Leveraging unmatched expertise in Two-Phase technology, ACT designs and manufactures CDUs that are robust, intelligent, and purpose-built to lead this critical evolution.
Two-Phase Direct-to-Chip cooling solutions for modern data centers
Scalable CDU Platform for AI, HPC, and Edge Workloads
As compute densities rise and GPUs push thermal limits, traditional single-phase cooling is falling short. Two-Phase direct-to-chip cooling is emerging as a more efficient solution—offering lower pumping power, higher heat transfer performance, and uniform chip temperatures using safe, dielectric fluids.
At the core of this architecture are ACT’s Coolant Distribution Units (CDUs), which precisely manage heat transfer between facility cooling systems and chip-level cold plates.
With decades of expertise, proven deployments, and leadership in ARPA-E and DARPA programs, ACT delivers intelligent, scalable CDUs that enable safe, energy-efficient cooling across rack, row, and edge environments—helping operators confidently scale for next-gen compute.
Why Two-Phase Direct-to-Chip Cooling Redefines Data Center Efficiency
Two-Phase direct-to-chip cooling leverages the latent heat of vaporization to absorb and transport heat far more efficiently than traditional liquid cooling methods. This enables higher performance with lower mass flow rates, reduced pumping power, and more uniform chip temperatures.
Unlike single-phase systems that depend on large volumes and high flow rates, ACT’s Two-Phase CDUs deliver coolant directly to cold plates mounted on processors and high-power components. The liquid absorbs heat, vaporizes, and returns to the CDU where it condenses and recirculates—creating a continuous, closed-loop cycle that maximizes thermal transfer while minimizing energy consumption.
Key Advantages
Direct, efficient heat removal at the chip
Significantly lower pumping power and energy consumption
Compact infrastructure with smaller fluid loops
Uniform thermal performance across high-density loads
Dielectric refrigerants ensure electrical safety and system reliability
Ideal for AI training, GPU clusters, HPC pods, and edge systems
Two CDU Configurations. One Proven Platform.
ACT’s CDU platform is built to support Two-Phase direct-to-chip cooling across a variety of environments. All configurations share the same proven core architecture—designed for safety, scalability, and simplified serviceability.
200kW Today, 1 MW Tomorrow—This End-of-Row CDU Is Built to Scale
Scalable Direct-to-Chip Cooling for Multi-Rack Deployments
Purpose-built for the thermal intensity of AI, machine learning, and high-performance computing, ACT’s End-of-Row CDU delivers high-capacity, Two-Phase direct-to-chip cooling for large-scale infrastructure. Using two-phase heat transfer, it efficiently manages chip-level heat across up to 10 high-density racks.
Featuring a dielectric refrigerant for safety and thermal efficiency, the compact system includes smart diagnostics, a touchscreen HMI, and N+1 pump redundancy designed for uptime, serviceability, and future scalability.
Key Features & Benefits
200kW-1MW cooling capacity
Two-Phase operation with dielectric refrigerant
Smart diagnostics and touchscreen HMI
N+1 pump redundancy and hot-swappable service connections
Compact footprint
Facility water inlet temperature range: +7°C to +45°C
Have specific questions about integrating a Two-Phase 200kW CDU into your infrastructure? Connect directly with our experienced engineers for a preliminary call to discuss your unique requirements and find the optimal cooling solution.
15kW in Just 8U — This In-Rack CDU Delivers Where Space Is Tight
Localized Two-Phase Cooling for Rack-Level and Edge Applications
For edge, storage, telecom, and space-constrained environments, ACT’s In-Rack CDU offers reliable Two-Phase direct-to-chip cooling in a compact 8U form factor. It integrates into a standard 19″ rack and delivers precise thermal management using dielectric refrigerant.
This CDU supports localized cooling for single racks or modular deployments—ideal for distributed compute nodes or environments where floor space and thermal control are critical.
Key Features & Benefits
15 kW cooling capacity
Variable-speed 24VDC pump with analog control
Dielectric refrigerant with closed-loop water-side circuit
Integrated mechanical and electronic bypass valves
Dry-break manifold couplings for fast, clean servicing
Maximize rack density and eliminate hot spots with our compact Two-Phase 15kW In-Rack CDU. Designed for targeted cooling of high-density server environments, it delivers efficient and reliable thermal management directly within your IT cabinets. Connect with our engineers to discuss seamless integration and specific rack requirements.
With decades of innovation in Two-Phase cooling and deep engineering expertise across mission-critical industries, ACT provides a thermal management platform that’s ready for today’s workloads—and built to scale for what’s next. Whether you’re building at the edge or scaling a hyperscale facility, our CDUs are purpose-built to deliver reliable, high-efficiency cooling for the most advanced compute environments.
Ready to integrate ACT’s CDUs into your architecture? Talk to our experts today.
Let’s talk about what’s possible
Contact our team today to explore End-of-Row or In-Rack CDU solutions tailored to your application.
News: $1M Funding Awarded to ACT for Data Center Cooling
Video: Demystifying Data Center Cooling
Video: In-Rack vs End-Row Cooling
