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NASA Thermal and Fluids Analysis Workshop (NASA TFAWS)
Presenting Technical Papers: LHP Wick Fabrication via Additive Manufacturing. Bradley Richard, et al. Advanced Passive Thermal Experiment for Hybrid Variable Conductance Heat Pipes and HiK™ Plates on the International Space Station, Mohammed T. Ababneh, et al. Improved Wedgelocks for Electronics Cooling, Jens Weyant. et al. The Thermal and Fluids Analysis Workshop (TFAWS) is an annual training and professional development workshop that is designed to encourage knowledge sharing, professional development, and networking throughout the thermal and fluids engineering community within NASA…
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ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK 2017)
Presenting Technical Paper: Integrated Vapor Chamber Heat Spreader for Power Module Applications.” (Clayton Hose) InterPACK is the premier international forum for exchange of state-of-the-art knowledge in research, development, manufacturing, and applications of electronic packaging, MEMS, and NEMS. It is the flagship conference of the ASME Electronic and Photonic Packaging Division (EPPD). The InterPACK Conference Series was founded in 1992 as the ASME-JSME Joint Electronic Packaging Conference and was renamed InterPACK in 1995. The InterPACK Advisory Committee (IAC) was and EPPD Executive…
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World Energy Engineering Congress (WEEC)
Exhibiting at booth #408 The WEEC is the one truly comprehensive event where you can fully assess the "big picture" and see exactly how the economic and market forces, new technologies, regulatory developments and industry trends all merge to shape your critical decisions, as well as define what specific steps are needed to achieve optimum energy efficiency and performance within your organization.
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WEFTEC 2017
Exhibiting at booth #8737 WEFTEC® is recognized as the world’s largest annual water quality technical conference and exhibition, providing extensive educational opportunities and unparalleled access to the field’s most cutting-edge technologies and services.
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Emerson Exchange 2017
Exhibiting at booth #418 The Emerson Global Users Exchange is more than an industry-leading technical conference…it is a community of process automation leaders committed to extracting the most from their automation investments…and sharing their learning with each other.
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