In high-performing electronics systems in both terrestrial and aerospace applications, every degree counts. ACT’s HiK™ conduction cooling frames utilize strategically placed heat pipes to move heat from source electronics to conduction card edges or to heat sinks in order to minimize temperature rise at the sensitive electronics. ACT can embed heat pipes completely or partially into aluminum frames to meet the geometric constraints of your system. ACT can manufacture within an ultrathin profile allowing customers to meet size and weight (SWaP) specifications without sacrificing thermal performance.
HiK™ Card frames features include:
- Customer Required Mounting Features
- Coatings/Platings per request
- Multiple Standoff Heights
- Fully embedded into the minimum thickness of 0.072″ (1.83mm)
- Thermal Conductivity > 600 W/m-K (Up to 1,200 W/m-K)
- Ruggedized MIL-STD 810 specifications
ACT is experienced with VITA, VME and VPX specifications and can customize 3U, 6U or 9U cards to significantly increase thermal conductivity and lower electronics temperature. With ACT’s experience, Custom HiK™ Conduction Cards typically require only a week of engineering design and don’t affect mounting patterns, geometry or other features critical to your design. ACT supplies complete card assemblies including heli-coils, EMI gasketing, and a variety of platings and coating as required.