Technical Papers
Passive Thermal Management for Avionics in High Temperature Environments
Michael C. Ellis, William G. Anderson, and Jared R. Montgomery. SAE 2014 Aerospace Systems and Technology Conference, Cincinnati, OH, September 23-25, 2014.
Passivation of Aluminum Nanoparticles by Plasma-Enhanced Chemical Vapor Deposition for Energetic Nanomaterials
T. Desai et al., ACS Applied Materials and Interfaces Journal, 2014, 6 (10), pp. 7942–7947, DOI: 10.1021/am5012707
Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes
Ababneh, Mohammed T., Shakti Chauhan, Pramod Chamarthy, and Frank M. Gerner. “Thermal Modeling and Experimental Validation for High Thermal Conductivity Heat Pipe Thermal Ground Planes.” Journal of Heat Transfer 136, no. 11 (2014): 112901.
Launch Vehicle Avionics Passive Thermal Management
W. G. Anderson et al., “Launch Vehicle Avionics Passive Thermal Management,” 44th International Conference on Environmental Systems (ICES 2014), Tucson, AZ, July 13-17, 2014.
Low Cost Radiator for Fission Power Thermal Control
Taylor Maxwell et al, 12th International Energy Conversion Engineering Conference (IECEC), Cleveland, OH, July 28-30, 2014.
Flow Boiling Heat Transfer Enhancement in Subcooled and Saturated Refrigerants in Minichannel Heat Sinks
E. Yakhshi-Tafti et al., ASME 2014 4th Joint US-European Fluids Engineering Division Summer Meeting and 12th International Conference on Nanochannels, Microchannels, and Minichannels, August 3-7, 2014, Chicago, IL.
Thermal-Fluid Modeling for High Thermal Conductivity Heat Pipe Thermal Ground Planes
M. T. Ababneh et al., published in the AIAA Journal of Thermophysics and Heat Transfer, Vol. 28, No. 2, pp. 270-278, April 2014.
Thermoelectric Performance Model Development and Validation for a Selection and Design Tool
Thomas Nunnally, Devin Pellicone, Nathan Van Velson, James Schmidt, Tapan Desai, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014.
High Heat Flux Heat Pipes Embedded in Metal Core Printed Circuit Boards for LED Thermal Management
Dan Pounds, Richard W. Bonner III, 2014 IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), Orlando, FL, May 27-30, 2014