Technical Papers
Die Level Thermal Storage for Improved Cooling of Pulsed Devices
Richard Bonner III, et al., Semitherm, San Jose, CA., March 2011
A 2-D Numerical Study of Microscale Phase Change Material Thermal Storage for GaN Transistor Thermal Management
Xudong Tang, et al., Semitherm, San Jose, CA, March 2011
Dynamic Response of Phenolic Resin and Its Carbon-nanotube Composites to Shock Wave Loading
Arman, et. al., Journal of Applied Physics, 109, 013503 (2011)
Loop Heat Pipe with Thermal Control Valve for Variable Thermal Conductance Link of Lunar Landers and Rovers
Loop Heat Pipe with Thermal Control Valve for Variable Thermal Conductance Link of Lunar Landers and Rovers, J. R. Hartenstine et al., 49th AIAA Aerospace Sciences Meeting, Orlando, FL, January 4-7, 2011.
Electronics Cooling Using High Temperature Loop Heat Pipes with Multiple Condensers
William G. Anderson, et al., SAE Power Systems Conference, Ft. Worth, TX, November 2010
Development of Heat Pipe Loop Technology for Military Vehicle Electronics Cooling
Xudong Tang et al., NDIA Ground Vehicle Systems Engineering and Technology Symposium, Dearborn, Michigan, August 2010
Dropwise Condensation Life Testing of Self Assembled Monolayers
Richard Bonner III, IHTC14, Washington, DC, August 2010
Heat and Mass Transfer in a Permeable Fabric System Under Hot Air Jet Impingement
Sangsoo Lee et. al., International Heat Transfer Conference (IHTC14), Washington, DC, August, 2010
Variable Thermal Conductance Link for Lunar Landers and Rovers
William G Anderson et. al., IECEC, Nashville, Tennessee, July, 2010