Technical Papers
Development of a Variable Conductance Cold Plate for Spatial and Temporal Isothermality Across Power Scales
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Elizabeth Seber and Michael Ellis.
Demonstration of Ice Extraction and Ice Collection System for Lunar Ice Miners
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Kuan-Lin Lee, Sai Kiran Hota, Quang Truong, et al.
Experimental Comparison of Two-Phase Heat Spreaders for Space Modular Electronics
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Sai-Kiran Hota, Greg Hoeschele, Tanner Mcfarland, Srujan Rokkam, et al.
Novel Vapor Chambers for Heating and Cooling of Advanced Sorption Systems
52nd International Conference on Environmental Systems ICES-2023-131
16-20 July 2023, Calgary, Canada, Haley E. Myer and Michael C. Ellis
Two-Phase Thermal Switch for Lunar Lander and Rover Thermal Management
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineer Nathan Van Velson.
Development of Flight Demonstration Hot Reservoir Variable Conductance Heat Pipes for Microgravity Testing and Future Lunar Landers and Surface Systems
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineer Kuan-Lin Lee.
3D Printed Wicks for Loop Heat Pipes
Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Rohit Gupta, Chen-Hua Chien, and William Anderson.
Efficient Poisson’s Ratio Evaluation of Weft-Knitted Auxetic Metamaterials
Published in the special issue of Textiles: Advances in Technical Textiles, by Kuan-Lin Lee and Srujan Rokkam.
Pulsating Heat Pipe and Embedded Heat Pipe Heat Spreaders for Modular Electronics Cooling
Published in the Cast Studies in Thermal Engineering Journal by Sai Kiran Hota, Kuan-Lin Lee, Brett Leitherer, George Elias, Greg Hoeschele, and Srujan Rokkam.