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Technical Papers

Demonstration of Ice Extraction and Ice Collection System for Lunar Ice Miners

Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Kuan-Lin Lee, Sai Kiran Hota, Quang Truong, et al.

Experimental Comparison of Two-Phase Heat Spreaders for Space Modular Electronics

Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Sai-Kiran Hota, Greg Hoeschele, Tanner Mcfarland, Srujan Rokkam, et al.

Novel Vapor Chambers for Heating and Cooling of Advanced Sorption Systems

52nd International Conference on Environmental Systems ICES-2023-131
16-20 July 2023, Calgary, Canada, Haley E. Myer and Michael C. Ellis

Two-Phase Thermal Switch for Lunar Lander and Rover Thermal Management

Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineer Nathan Van Velson.

Development of Flight Demonstration Hot Reservoir Variable Conductance Heat Pipes for Microgravity Testing and Future Lunar Landers and Surface Systems

Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineer Kuan-Lin Lee.

3D Printed Wicks for Loop Heat Pipes

Presented at the International Conference on Environmental Systems (ICES) 2023, in Calgary, Alberta, July 16-20, 2023 by ACT Engineers Rohit Gupta, Chen-Hua Chien, and William Anderson.

Efficient Poisson’s Ratio Evaluation of Weft-Knitted Auxetic Metamaterials

Published in the special issue of Textiles: Advances in Technical Textiles, by Kuan-Lin Lee and Srujan Rokkam.

Pulsating Heat Pipe and Embedded Heat Pipe Heat Spreaders for Modular Electronics Cooling

Published in the Cast Studies in Thermal Engineering Journal by Sai Kiran Hota, Kuan-Lin Lee, Brett Leitherer, George Elias, Greg Hoeschele, and Srujan Rokkam.

Demonstration of CTE-Matched Two-Phase Minichannel Heat Sink

Presented at the 22ND IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM), May 30 – June 2nd by ACT engineers Oveis Shaeri, Chien-Hua Chen, and Maksym Demydovych.