Thermal management issues impact the performance and reliability of high-power electronics, such as laser diodes. Liquid cooling through complex flow passage design (e.g. microchannels) at the heat source is the state-of-the-art solution. Unfortunately these microchannel coolers can have very short operating lives due to current leakage, erosion and corrosion effects. High purity de-ionized water (DIW) is used to minimize current leakage. But DIW attacks metal parts accelerating the corrosion process. Erosion further damages the flow channels under continuous high speed liquid flow. For example, the standard lifetime of microchannel coolers for laser diodes is 6 months.
A copper plate was coated with the ANCER™ coating and the ACT logo was masked in the center of the plate. When removed, the mask revealed an uncoated bare copper logo while the remainder of the sample was protected by the ANCER™ coating. The copper plate was then heated from ambient to 400 ˚C in open atmosphere. As the copper sample increased in temperature, the uncoated bare copper logo thermally oxidized, reacting with oxygen in the atmosphere to create copper oxide. The formation of the copper oxide changed the color of the uncoated copper, as shown in the video. The ANCER™ coating protected the remainder of the copper sample from thermal oxidation, which retained its original color.
The vapor deposition coating technique ensures thin, uniform coating of complex geometries that are inaccessible for gold plating. This pin-hole free coating provides superior corrosion resistance. As can be seen in Fig 1., corrosion rate is two orders of magnitude lower for the ANCER™ coating compared to gold plating over a wide range of pH values and water qualities. Life testing in high velocity flows (up to 4.8 m/s) and thermal cycling testing (30°C – 75°C) also demonstrated its high erosion-corrosion resistance and durability. Finally, the dielectric property and nanoscale thickness of this coating makes it an ideal electrical insulator without hindering the thermal path from source to evaporator.