Technical Papers
Pressure Controlled Heat Pipe Applications
W. G. Anderson et al., 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012.
The Effect of Device Level Modeling on System-Level Thermal Predictions
Jens Weyant, et al., ITherm, San Diego, CA, May 30, 2012,
Integration of a Phase Change Material for Junction-Level Cooling in GaN Devices
Daniel Piedra, et al., Semitherm, San Jose, CA, March 2012
An Innovative Passive Cooling Method for High Performance Light-emitting Diodes
Angie Fan, et al., Semitherm, San Jose, CA, March 2012
Ultra High Temperature Isothermal Furnace Liners (IFLs) For Copper Freeze Point Cells
Peter Dussinger and John Tavener, 9th International Temperature Symposium, Anaheim, CA, March 2012
High Heat Flux, High Power, Low Resistance, Low CTE Two-Phase Thermal Ground Planes for Direct Die Attach Applications
Peter Dussinger, et al., GOMACTech 2012, Las Vegas, Nevada, March 2012
Passive Control of a Loop Heat Pipe with Thermal Control Valve for Lunar Lander Application
K. L. Walker et al., 42nd International Conference on Environmental Systems (ICES 2012), San Diego, CA, July 15-19, 2012.
A Computational Model of a Phase Change Material Heat Exchanger in a Vapor Compression System with a Large Pulsed Heat Load
G. Troszak and X. Tang, Proceedings of the ASME 2012 Summer Heat Transfer Conference, Puerto Rico, July 8-12, 2012.
2-D Simulation of Hot Electron-Phonon Interactions in a Submicron Gallium Nitride Device Using Hydrodynamic Transport Approach
Angie Fan et al., ASME 2012 Summer Heat Transfer Conference, Puerto Rico, USA , July 8-12, 2012