Technical Papers
Novel Junction Level Cooling in Pulsed GaN Devices
Tapan G. Desai, et al., ITherm, San Diego, CA, May 30, 2012,
Intermediate Temperature Heat Pipe Life Tests
W. G. Anderson, et al., 16th International Heat Pipe Conference, Lyon, France, May 20-24, 2012.
Passivation Coatings for Micro-Channel Coolers
Richard W. Bonner III, Jens Weyant, Evan Fleming, Kevin Lu, Daniel Reist, APEC 2012, Orlando FL, February 1, 2012
Pressure Controlled Heat Pipe Solar Receiver for Regolith Oxygen Production with Multiple Reactors
John Hartenstine, et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), San Diego, CA, July 31 – August 3, 2011
Thermal Management System for Long-Lived Venus Landers
Calin Tarau, et al., 9th Intersociety Energy and Conversion Engineering Conference (IECEC), San Diego, CA, July 31 – August 3, 2011
Pressure Controlled Heat Pipes
William Anderson, et al., 41st International Conference on Environmental Systems, Portland, OR, July 17-21, 2011
Variable Conductance Heat Pipe for a Lunar Variable Thermal Link
Chris Peters, et al., 41st International Conference on Environmental Systems, Portland, OR, July 17-21, 2011
Two-Phase Heat Sinks with Microporous Coating
T. Semenic and S. M. You, 9th International Conference on Nanochannels, Microchannels, and Minichannels, Edmonton, CA, June 19-22, 2011
Die Level Thermal Storage for Improved Cooling of Pulsed Devices
Richard Bonner III, et al., Semitherm, San Jose, CA., March 2011